I le taimi nei, DB-FIB (Dual Beam Focused Ion Beam) o loʻo faʻaaogaina lautele i suʻesuʻega ma suʻesuʻega oloa i luga o faʻalapotopotoga e pei o:
meamea keramika,Polymersmea u'ameasu'esu'ega o meaolaSemiconductors,Fa'afanua
Mea fa'akomepiuta, mea fa'ameamea la'ititi la'ititi, mea polymer, mea fa'apipi'i fa'aola, mea e le fa'ameamea.
Faatasi ai ma le televave o le alualu i luma o semiconductor electronics ma fesoʻotaʻiga fesoʻotaʻiga tekonolosi, o le faʻateleina o le lavelave o masini ma fausaga faʻataʻitaʻi ua siitia ai manaʻoga mo suʻesuʻega faʻataʻitaʻiga microelectronic chip, suʻesuʻega le manuia, ma le micro / nano fabrication.Le fa'aogaina o le Dual Beam FIB-SEM system, faʻatasi ai ma lona faʻaogaina mamana ma le faʻaogaina o suʻesuʻega microscopic, ua avea ma mea taua i le microelectronic design ma le gaosiga.
Le fa'aogaina o le Dual Beam FIB-SEM systeme tu'ufa'atasia uma le Focused Ion Beam (FIB) ma le Scanning Electron Microscope (SEM). E mafai ai ona mata'ituina e le SEM taimi tonu le faiga ole micromachining fa'avae ole FIB, tu'ufa'atasia le maualuga fa'afanua ole fa'aeletonika fa'aeletonika fa'atasi ai ma le sa'o lelei o mea e mafai ai ona fa'agaoioia le fa'alava o le ion.
Nofoaga-Sauniuniga Fa'asagaga Fa'apitoa
TEM Fa'ata'ita'iga Ata ma Su'esu'ega
Selective Etching po'o le Enhanced Etching Inspection
Metal ma le Insulating Layer Deposition Testing